12 KV/mm Dielectric Strength (ASTM D149)

Superior high voltage insulation performance

175℃-300℃ HDT (ASTM D648)

Excellent high-temperature dimensional stability

Phenolic resin (short for PF, also called Bakelite) is the earliest industrialized thermosetting polymer material, synthesized by the polycondensation reaction of phenol and formaldehyde. Once fully cured, it cannot melt or dissolve again, featuring stable physical and chemical properties under high temperature.

Flexural Strength 100 MPa；

Arc Resistivity 186 sec

UL94 V-0 Flammability

Self-extinguishing, flame retardant safety certification

Industrial electrical insulating parts, thermocouple wiring bases, automotive electrical accessories, switch housings, motor insulating frames, precision instrument components, heat-resistant kitchen utensils, brake pad substrates, fireproof boards, anti-corrosion adhesives and so on.

Heat Deflection Temperature

   280–290 ℃

Dielectric Strength

28–33 KV/mm

Features outstanding breakdown voltage performance, providing reliable high-voltage insulation protection to satisfy strict safety standards for precision electrical insulating parts.

Maintains stable dimension without softening or deformation under long-term high-temperature loaded working conditions, suitable for high-heat electrical component applications.

DAP, short for Diallyl Phthalate, also known as electric ester plastic, is a high-performance cross-linking thermosetting resin. Compounded with glass fiber or inorganic mineral fillers, it forms DAP molding compound, a premium insulating material.

CTI ≥600V | Superior Surface Tracking Resistance under Damp & Polluted Condition

Arc Resistance ≥190s | Strong Anti-ablation Performance against Electric Arc Impact

Possesses self-extinguishing flame retardant property. The halogen-free formula complies with global environmental and fire safety regulations for electronic and electrical products.

widely applied to thermocouple bases, precision electronic connectors, automotive high-voltage insulating parts, communication equipment components and industrial high-temperature electrical modules, suitable for injection molding of high-reliability insulating parts with strict heat-resistance and flame-retardant requirements.

Heat Deflection Temperature

  250–260 ℃

 Dielectric Strength

30–35 KV/mm

Excellent high-voltage breakdown performance provides reliable insulation protection for electronic and electrical insulating components.

High thermal deformation resistance ensures molded parts maintain stable size and structure under continuous high-temperature working environments.

UP (Unsaturated Polyester) is a high-performance granular thermoset molding compound. It is compounded with unsaturated polyester resin as the base, reinforced by glass fiber and inorganic mineral fillers, matched with curing agents, release agents and functional additives. After heating cross-linking curing, the material becomes infusible and insoluble permanently, designed for thermoset injection molding of high-reliability electrical insulating parts. 

CTI ≥600V | Excellent Anti-Tracking Performance in Humid & Polluted Environment

Arc Resistance ≥180s | Superior Anti-Carbonization Against Electric Arc Impact

Self-extinguishing flame retardant property meets international fire safety and eco-friendly standards for electrical products.

This halogen-free unsaturated polyester molding compound is widely used for thermocouple bases, high-voltage switch parts, new energy automotive electrical components, precision electronic connectors and industrial high-temperature insulating products, ideal for injection-molded parts demanding high dimensional stability and electrical safety.

Dielectric strength 25–35 kV/mm; Volume resistivity 10¹⁴–10¹⁶ Ω·cm, ultra-low dielectric loss at high frequency

Stable insulation property under high voltage, low signal loss for sensors and circuit boards, reliable protection for sensitive electronic parts.

HDT (1.8MPa) >200°C; Max continuous service temperature 180°C (20,000h), short-term peak 250°C

Excellent sustained high-temperature resistance, minimal deformation under long-term heat load, suitable for automotive electronic components enduring persistent thermal stress.

EP stands for Epoxy Resin, a high-performance thermosetting molding compound. It is formulated with epoxy resin as base resin, reinforced by glass fiber, mineral fillers, curing agents and functional additives. After cross-linking curing under heat, EP becomes permanently infusible and insoluble, featuring ultra-stable electrical, thermal and mechanical properties. It is widely used for precision electronic and high-reliability insulation parts via thermoset injection or compression molding.

Molding shrinkage 0.40–0.60%, post shrinkage ≤0.05%, water absorption ≤0.1%

Near-zero post-curing shrinkage, tight dimensional precision; tight media-tight bonding with metal inserts, excellent thermal shock crack resistance for encapsulated automotive sensors.

Epoxy molding compound is widely used for automotive sensor & ECU encapsulation, EV power modules, industrial high-temperature electronic insulators, precision PCB overmolding and aerospace high-reliability electrical components. It is ideal for parts requiring media-tight metal bonding, thermal shock crack resistance and stable high-voltage insulation.